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Bach 1.0 – Underfill Removal Blade
$18.65
Mach Blade Series – Ma1.0 Underfill Removal Blade This Blade Helps You Removing Underfill From The Logic Board Around Ic Chips To Help The Microsoldering Process. 2Mm Blade Easily Copes With A Variety Of Small Size Ic. 1. Heated By Hot Air Gun, 2. Cut The Side Edge Of The Blade And Take It Out.
Product description
Mach Blade Series - Ma1.0 Underfill Removal Blade This Blade Helps You Removing Underfill From The Logic Board Around Ic Chips To Help The Microsoldering Process. 2Mm Blade Easily Copes With A Variety Of Small Size Ic. 1. Heated By Hot Air Gun, 2. Cut The Side Edge Of The Blade And Take It Out.
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