Solder Flux Paste Blue Bottle 100G (559) (Mechanic)
It Can Be Used For Rework Sphere Or Pin Attachment To Bga Pga And Csp Packages And Assemble Operations Such As Flip Chip Attachment To Pwb Substrates It Is A Necessary And Helpful Tool In Bga Reballing. Excellent Capacity Of Solder-Stickiness Excellent Anti-Wet Capacity Widely Used On Bga Pga Csp Packages And Flip Chip Operation Suitable For Multiple Pcb Reflow No-Clean And Lead Free For Environmental Protection.
Product description
It Can Be Used For Rework Sphere Or Pin Attachment To Bga Pga And Csp Packages And Assemble Operations Such As Flip Chip Attachment To Pwb Substrates It Is A Necessary And Helpful Tool In Bga Reballing. Excellent Capacity Of Solder-Stickiness Excellent Anti-Wet Capacity Widely Used On Bga Pga Csp Packages And Flip Chip Operation Suitable For Multiple Pcb Reflow No-Clean And Lead Free For Environmental Protection.
Product specification
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